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Samsung M33 SM-M336 128Gb

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IntroductionIntroduction:
BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated SM-M336BU/DS Galaxy M33 5G 2022 Premium Edition Dual SIM TD-LTE IN 128GB
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet Galaxy M33 is up for letting you make and.. ››
ReleasedFirst official market release date in (year, month) 2022 Apr 2
AnnouncedDate of the official announcement (year, month) 2022 Mar 7
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
CodenameThe codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename Samsung M336
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series M336BZBRINS
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc. Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc. SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.

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Physical AttributesPhysical Attributes:
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 76.9 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 165.4 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 9.4 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 3.03×6.51×0.37 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 215 g
7.58 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment:
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc. Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 12 (S)Google Android 12 (S)
One UI 4.1Subversion, update version, user interface, defualt language, etc.
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc. Voice Command , Navigation softwarepre-installed , Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset:
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2400 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Samsung Exynos 1280 5G S5E8825, 2022, 64 bit, octa-core, 5 nm, ARM Mali-G68 GPUSamsung Exynos 1280 5G S5E8825, 2022, 64 bit, octa-core, 5 nm, ARM Mali-G68 GPU

Operative MemoryOperative Memory:
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM). LPDDR5 SDRAM
2750 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 8 GiB RAM

Non-volatile MemoryNon-volatile Memory:
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 128 GB ROM
103000 MiB total user storageThe sum of primary and secondary user-accessible partition of non-volatile storage spaces

DisplayDisplayAll parameters that related to display
Display NotchNumber of display notches (or cutouts) 1-notch
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 167.2 mm
6.6 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1080×2408
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 8.48 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 82.1%
Pixel DensityIndicates the number of pixels per inch 401 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Display SubtypeBrand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBlack, etc. Yes
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display Refresh RateFrame refresh frequency of the main display 120 Hz
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass Gorilla Glass 5
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